MLT offers laser microvia drilling in both copper clad and unclad laminates. While we do recommend that outer layer foils be kept to half ounce or thinner for process efficiency, we are capable of handling much thicker copper cladding if your design calls for them.
Please see our PCB Materials section for more information on the range of materials that MLT is capable of processing or give us a call if you want to discuss a particular application.
Microvia hole diameters are limited by aspect ratio (hole depth to hole diameter). As the hole depth exceeds the hole diameter, laser drilling quality can be affected. Please contact MLT for microvia size requirements that exceed a 1:1 aspect ratio.
CAD or Data Requirements
CAD system integration and custom file converters enable flexible, laser manufacturing from customer-provided data. Although most file types are accepted, the preferred file types for microvia drilling are Gerber, Excellon, DXF, or other 2D formats.
For more CAM/CAD guidelines and detailed requirements, click CAD Requirements.
Drilling and Machining Tolerances
|Positional:||+/- .001” over 12 inches|
|Hole Sizes:||.001” and up in diameter|
|Panel Sizes:||24” x 30” without custom fixturing|
FR4 all types
Rogers (Duroid & Teflon)
Woven Glass (106,1080,2216,2213,2313)
FEP (fluorinated ethylene propylene)
LCP (Liquid Crystal Polymer)
PPE (polyphenylene ether)
Blind – single and double deep