Micron Laser Technology provides laser processing of both wires and cables for various close tolerance and small feature size applications. MLT's laser insulation removal was developed to eliminate the risk of damaging the wire or conductor as seen when using traditional mechanical wire stripping tools. Our wire stripping, cable polymer (insulation) removal, and accurate length cuts will cost-effectively address all wire and cable constructions including:
- Micro-coax Cables
- Ribbon Cables
- Twisted-Pair Cables
- Extruded Single Conductor
- Microwave Coaxial Cables
- Flat Flexible Cables (FFCs)
- Fiberglass (FR4)
- Multi-layer Conductors
- Infiniband Cables
- Braided Cables
- PTFE (Teflon)
- Kapton (polyimide)
- Tape/Foil Wrapped Cables
- Shielded Cables
- Enamel Coated Wire (inductors)
- All Polymer Insulations
The laser removed insulation process uses a wavelength and power that absorbed by the insulation layer, but reflected by the metal conductor without damage. For stripping, this is generally a two sided processes that nets a full circumference ablation of the conductor(s). This will allow for the insulation to be pulled off from one end.
Laser Insulation Removal Advantage
- No conductor damage
- Accuracy to 25um
- Shield removal
- Non-contact, fine wire stripping
- Enamel removal
- Cable marking removal
- All cable constructions and sizes
- Selective or 'window' removal
For cables or wires where insulation must be removed in between two ends, our laser insulation services can remove selective areas of insulation and/or bonded enamel free from any mechanical forces leaving clean, exposed conductors. Our laser processes control laser energy and power based on insulating material. This prevents too much heat transfer to the metal conductors that could compromise insulation downstream from your initial process area.
Laser marking of most cables and wire insulation can include alpha-numerics and logos regardless of size. Our laser cable scribing services are utilized to process cables with metalized shielding. The laser cuts the metal shielding to a controlled depth that acts as the break line. The shield can be mechanically removed along the scribe line to expose the underlying dielectric. For larger diameter conductors, the shield can be cut completely free by laser without compromising the conductor.
To request a quote or discuss application details, contact our sales staff or submit a Request for Quote.