Laser contouring is also a great way to generate pattern routed b-stage adhesive. The laser process can form a 'cured' edge along the rout path of the adhesive to reduce the amount of resin squeeze-out that is released by the lamination process. MLT laser circuit routing techniques minimize the amount of heat affect and carbon recast onto the part. PCB material sets that can't avoid some carbonized deposits, MLT provides post laser part cleaning to remove any visible carbon.
Laser routing of rigid circuits or depaneling services are also available, but some material stackups and tolerance limitations may exist. Please contact our sales staff to discuss your rigid routing requirements. Whether you PCB application is single-sided, double-sided, multi-layer, or rigid, MLT's laser routing processes are configured for same day or next day turns for most applications for prototype quantities to highest volume levels.
CAD or Data Requirements
CAD system integration and custom file converters enable flexible, laser manufacturing from customer-provided data. Although most file types are accepted, the preferred file types are Gerber, Excellon, DXF, or other 2D formats. In most cases, non-scaled data is required as MLT will make the appropriate scaling or offsets to meet part dimensions.
If concerned about compatibility of your data format or CAD/CAM tool, please contact MLT Sales for more information. For more CAM/CAD guidelines and detailed requirements, click CAD Requirements.
PCB Standard Routing Tolerances
|Infrared (CO2)||Ultraviolet (UV)|
|Positional:||+/-.002” (50um)||+/-.001” (25um)|
|Dimensional:||+/-.002” (50um)||+/-.001” (25um)|
|Depth:||Application Dependent||Application Dependent|
FR4 all types
Rogers (Duroid & Teflon)
FEP (fluorinated ethylene propylene)
LCP (Liquid Crystal Polymer)
PPE (polyphenylene ether)