Laser skiving can be performed to clear all dielectric material or to stop without cutting all the way through (controlled depth). For skiving applications that require a controlled depth without landing on metal, the depth tolerance and cavity's (or feature) surface topography is a function of the material. The more homogeneous the dielectric, the less variation in depth tolerance.
Other products such as dry films used with lead-free electroplating and stencil printing applications are easily laser skived to the smallest of feature sizes . MLT has developed processes to handle a wide range of materials from flexible dielectrics to rigid, reinforced materials and even some thin metals.
Whatever your skiving needs, MLT has the solution!
CAD or Data Requirements
CAD system integration and custom file converters enable flexible, laser manufacturing from customer-provided data. Although most file types are accepted, the preferred file types are Gerber, Excellon, DXF, or other 2D formats. In most cases, non-scaled data is required as MLT will make the appropriate scaling or offsets to meet part dimensions.
If concerned about compatibility of your data format or CAD/CAM tool, please contact MLT Sales for more information. For more CAM/CAD guidelines and detailed requirements, click CAD Requirements.
PCB Standard Skiving Tolerances
|Infrared (CO2)||Ultraviolet (UV)|
|Positional:||+/-.002” (50um)||+/-.001” (25um)|
|Dimensional:||+/-.002” (50um)||+/-.001” (25um)|
|Depth:||Application Dependent||Application Dependent|
FR4 all types
Rogers (Duroid & Teflon)
FEP (fluorinated ethylene propylene)
LCP (Liquid Crystal Polymer)
PPE (polyphenylene ether)