Microvia
Microvias are becoming more and more common in the board designs of today. There are many benefits to laser drilling microvias, including real estate savings, impedance control, circuit longevity, and RF line termination. For this reason, MLT has developed laser microvia processes to work with a very wide range of materials and via profiles to fit your designs.
Drilling and Machining Tolerances
| Positional:
| +/-.001” over 12 inches |
| Dimensional:
| +/-.001” |
| Hole Sizes:
| +/-.001”and up diameter |
| Panel Sizes:
| 24” x 30” without custom fixturing |
Dielectrics
| FR4 all types |
Hitachi |
Soldermask |
| Isola |
Gore |
Rogers(Duroid & Teflon) |
| Getek |
RCC |
|
| Nelco |
Ceramics |
|
Reinforcements
| Woven Glass (106,1080,2216,2213,2313) |
Aramid (Thermount) |
| Non-woven glass |
PTFE |
Chemistries
| BCB (benzocyclobutene) |
Epoxy |
Cyanate ester |
| PEEK (polyetheretherketone) |
Epoxy blends |
Polyimide |
| FEP (fluorinated ethylene propylene) |
Polyester |
Acrylics |
| LCP (Liquid Crystal Polymer) |
PPE (polyphenylene ether) |
BT resins |
 |
|
Via Construction
| Blind - single and double deep |
Buried |
Stepped |
| Staggered |
Stacked |
Through-hole |
MLT offers laser microvia drilling in both copper clad and unclad laminates. While we do recommend that outer layer foils be kept to half ounce of thinner for process efficiency, we are capable of handling much thicker coppers if your design calls for them. Please see our materials section for more information on the range of materials that MLT is capable of processing or give us a call if you want to discuss a particular application.
* Maximum specifications are not necessarily compatible (e.g.- a .080” deep via needs to be larger than .001” diameter). Please contact MLT for specification verification.
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