Skiving

Skiving is a process that allows for the controlled removal of material. Typical applications are finger or pad exposures for flex circuits or cavity formation on rigid circuits. Laser skiving can be performed to clear all dielectric material or to stop without cutting all the way through (controlled depth). MLT has developed processes to handle a wide range of materials from flexible dielectrics to rigid, reinforced materials and even some thin metals. Whatever your skiving needs, MLT has the solution.

MLT Standard Skiving tolerances

Positional:	+/-.002” (.050mm)
Dimensional:	+/-.002” (.050mm)
Depth:	Material/Design Dependent

MLT Advanced Skiving tolerances

Positional:	+/-.001” (.025mm)
Dimensional:	+/-.001” (.025mm)
Depth:	Material/Design Dependent