Custom Laser Cutting and Manufacturing
Not all Laser Processes are Created Equally! With over 20 years dedicated to laser process development, let Micron Laser Technology be an extension of your factory floor.
Laser Material Processing Services and Contract Manufacturing
Micron Laser Technology is an AS9100D / ISO9001:2015 certified and ITAR registered laser service provider for the medical, aerospace, defense, and electronics industries.
With an 18,000 sqft facility dedicated to laser material processing utilizing twenty plus laser systems of various wavelengths, Micron Laser Technology (MLT) advances their customers’ schedules, process capabilities and product differentiation. Laser process applications include laser drilling, close tolerance routing, control depth skiving, part marking, prototyping, and micro-machining.
With the custom integration of CO2, UV, and YAG laser systems and more than 20 years of laser process development, MLT has specialized in the laser machining of most any metal or plastic of less than .100″ in thickness. By employing high-resolution encoders/galvos and optical alignment, MLT provides a positional and dimensional accuracy of up to +/- 10um.
Additionally, MLT provides dedicated laser applications for rigid (PCB) and flexible circuit (FPC) manufacturers inclusive of microvia (uVia) drilling, ZIF routing, squeeze-out removal, window skiving, selective soldermask removal, trace trimming, part marking, serialization, cavity formation and general PCB rework.
We’re proud to offer Same Day turn times!
Most Requested Services
Laser Cutting & Services
Micron Laser Technology provides a number of laser services and part manufacturing services including metal laser cutting, laser skiving, and laser drilling.
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PCB Laser Processing
Our PCB laser processes are customized for both rigid (PCB) and flexible circuit (FPC) applications. PCB Laser Applications include Microvia drilling, skiving, and more.
PCB Rework
MLT offers a range of precision laser rework and recovery options including solder mask removal, squeeze-out removal, IC marking, and more.