PCB Laser Micro-via Drilling
PCB laser micro-via drilling is becoming more and more common in the board designs of today. There are many benefits to laser drilling microvias, including real estate savings, impedance control, circuit reliability, and RF line termination. For this reason, MLT has developed laser microvia processes to work with a very wide range of materials and via profiles to fit your designs that meet IPC standards.
MLT offers laser drilling microvias in both copper clad and unclad laminates. While we do recommend that outer layer foils be kept to half ounce or thinner for process efficiency, we are capable of handling much thicker copper cladding if your design calls for them.
Microvia hole diameters are limited by aspect ratio (hole depth to hole diameter). As the hole depth exceeds the hole diameter, laser drilling quality can be affected. Please contact MLT for microvia size requirements that exceed a 1:1 aspect ratio.
Please see our PCB Materials section for more information on the range of materials that MLT is capable of processing or give us a call if you want to discuss a particular application.
FEP (fluorinated ethylene propylene)
LCP (Liquid Crystal Polymer)
PPE (polyphenylene ether)