To meet the required ZIF thickness (typical .012″), polyimide or polyester “stiffener” is attached under the connector circuit to create the proper thickness. The stiffener thickness is adjusted to the construction of the circuit (single sided, double sided, or multi-layered circuit). MLT laser routing processes can adjust laser energy control on the fly as the stackup thickness and materials change (i.e. transition from 4mil flex to 12mil flex/stiffener). Without proper laser energy control, the thinner circuit areas can be over processed exhibiting charring or discoloration from the higher energy required to rout the thicker flex sections or metal cutting areas.
ZIF copper contacts or fingers are exposed by coverlay openings to expose the copper fingers for the ZIF connector. MLT also provides laser services for routing or skiving coverlay or other insulating materials. For more information about laser processing of coverlay, click to READ MORE…
CAD system integration and custom file converters enable flexible, laser manufacturing from customer-provided data. Although most file types are accepted, the preferred file types are Gerber, Excellon, DXF, or other 2D formats. In most cases, non-scaled data is required as MLT will make the appropriate scaling or offsets to meet part dimensions.
If concerned about compatibility of your data format or CAD/CAM tool, please contact MLT Sales for more information. For more CAM/CAD guidelines and detailed requirements, click CAD Requirements.